- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
12 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
3,534
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
2,494
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1 |
2,829
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1 |
3,023
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
3,863
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
2,542
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
4,355
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK W/CLIP F... |
1 |
2,811
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
2,481
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
2,356
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK W/CLIP F... |
1 |
3,964
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
4,545
In-stock
|
Get Quote |