Manufacturer:
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
HSE-B20381-035H-01 CUI Devices
HEAT SINK, EXTRUS...
1,200
RFQ
3,486
In-stock
Get Quote
907-33-2-21-2-B-0 Wakefield Thermal
HEAT SINK PIN FIN...
180
RFQ
2,313
In-stock
Get Quote
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