- Manufacturer：
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- CUI Devices (2)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | 1/2 BRICK HEATSINK... |
1 |
4,891
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
2,752
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
4,966
In-stock
|
Get Quote |