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TS391SNL250

Mfr.Part #: TS391SNL250

Manufacturer: Chip Quik, Inc.

Package/Case: -

Datasheet: Download

Description: THERMALLY STABLE SOLDER PASTE NO

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Manufacturer :: Chip Quik, Inc.

Product Category :: Solder

Composition :: Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :: -

Flux Type :: No-Clean

Form :: Jar, 8.8 oz (250g)

Melting Point :: 423 ~ 428°F (217 ~ 220°C)

Mesh Type :: 4

Part Status :: Active

Process :: Lead Free

Shelf Life :: 12 Months

Shelf Life Start :: Date of Manufacture

Storage/Refrigeration Temperature :: 68°F ~ 77°F (20°C ~ 25°C)

Type :: Solder Paste

Wire Gauge :: -

Datasheets: TS391SNL250

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