DIP628-014BLF

Mfr.Part #
DIP628-014BLF
Manufacturer
Amphenol Communication Solutions
Package/Case
-
Datasheet
Download
Description
CONN IC DIP SOCKET 28POS TIN
Manufacturer :
Amphenol Communication Solutions
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
28 (2 x 14)
Operating Temperature :
-
Part Status :
Obsolete
Termination :
Solder
Datasheets
DIP628-014BLF

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