| ZSC31010BOARDV1P1S |
Renesas Electronics Corporation |
3,502 |
SSC BOARD ZSC31010 V1.1 WITH SAM |
| ZSC31010CEB |
Renesas Electronics Corporation |
3,133 |
WAFER (UNSAWN) - BOX |
| ZSC31010CEC |
Renesas Electronics Corporation |
4,138 |
DICE (WAFER SAWN) - FRAME |
| ZSC31010CED |
Renesas Electronics Corporation |
2,183 |
DICE (WAFER SAWN) - WAFFLE PACK |
| ZSC31010CEG1-R |
Renesas Electronics Corporation |
3,853 |
IC INTERFACE SPECIALIZED 8SOIC |
| ZSC31010CEG1-T |
Renesas Electronics Corporation |
2,148 |
IC INTFACE SPECIALIZED SGNL COND |
| ZSC31010CIB |
Renesas Electronics Corporation |
4,154 |
WAFER (UNSAWN) - BOX |
| ZSC31010CIC |
Renesas Electronics Corporation |
3,480 |
DICE (WAFER SAWN) - FRAME |
| ZSC31010CIG1-R |
Renesas Electronics Corporation |
2,378 |
IC INTFACE SPECIALIZED SGNL COND |
| ZSC31010CIG1-T |
Renesas Electronics Corporation |
3,315 |
IC INTFACE SPECIALIZED SGNL COND |
| ZSC31010KITV2P1 |
Renesas Electronics Corporation |
4,870 |
ZSC31010KIT EVALUATION KIT V2.1 |
| ZSC31010MCREFBV1P0 |
Renesas Electronics Corporation |
3,639 |
ZSC31010 MASS CALIBR. REF. BOARD |
| ZSC31010MCSV1P1 |
Renesas Electronics Corporation |
2,353 |
ZSC31010 MASS CALIBRATION SYSTEM |
| ZSC31014EAB |
Renesas Electronics Corporation |
2,779 |
WAFER (UNSAWN) - BOX |
| ZSC31014EAC |
Renesas Electronics Corporation |
3,512 |
DICE (WAFER SAWN) - FRAME |
